PACKAGE, ELECTRONIC DEVICE, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOVABLE BODY

摘要

PROBLEM TO BE SOLVED: To provide a package improving airtightness.SOLUTION: A package comprises: a storage space portion 56; and a first substrate 50 forming at least a part of the storage space portion 56. A first through-hole 58 extending from a first principal surface 51 of an opposite side to the storage space portion 56 toward a second surface 52 of the storage space portion 56 side is provided in the first substrate 50. The first through-hole 58 has a first inclined portion 71 inclined from the second surface 52 toward the first principal surface 51 and a second inclined portion 72 inclined from one end of the first principal surface 51 side of the first inclined portion 71 toward the first principal surface 51 in a sectional view of the first through-hole 58. A second angle &thetas;2 between the second inclined portion 72 and the second surface 52 is greater than a first angle &thetas;1 between the first inclined portion 71 and the second surface 52, and the first through-hole 58 is sealed with a seal member 70.