| 发明名称 |
PACKAGE FOR OPTICAL MODULE |
| 摘要 |
A package for optical module includes a flat-plate-shaped metal base, and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to an upper surface of the metal base by soldering. The ceramic circuit board has a shape change portion in which the ceramic circuit board is changed in shape along the longitudinal direction, and a region of the ceramic circuit board not including the shape change portion is joined to the metal base by soldering. The shape change portion of the ceramic circuit board is a portion where a width is changed along the longitudinal direction, or a portion where a thickness is changed along the longitudinal direction. |
| 申请公布号 |
US2015334838(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201314410866 |
申请日期 |
2013.07.01 |
| 申请人 |
NIPPON TELEGRAPH AND TELEPHONE CORPORATION ;NTT ELECTRONICS CORPORATION |
发明人 |
Ogawa Ikuo;Kasahara Ryoichi;Nishizawa Toshiki;Mitsuhashi Yuji |
| 分类号 |
H05K1/18;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package for optical module comprising:
a metal base in the shape of a flat-plate; and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to an upper surface of the metal base by soldering, wherein the ceramic circuit board has a first portion in which the ceramic circuit board is changed in shape along the longitudinal direction, and a region of the ceramic circuit board not including the first portion is joined to the metal base by soldering. |
| 地址 |
Tokyo JP |
