发明名称 Microwave Module Lid
摘要 A microwave module lid is disclosed. The microwave module lid can include an inner side operable to define, at least in part, a cavity configured to have a radio frequency (RF) emitting component disposed therein. The microwave module lid can also include two or more dielectric layers proximate one another. Each layer can have a thickness, a dielectric constant, and a dielectric loss characteristic. In addition, the microwave module lid can include a metal backing layer proximate one of the dielectric layers to contain RF energy within the lid. The thicknesses, the dielectric constants, and/or the dielectric loss characteristics of the dielectric layers can be configured to minimize RF resonance in the cavity.
申请公布号 US2015334787(A1) 申请公布日期 2015.11.19
申请号 US201414281656 申请日期 2014.05.19
申请人 Raytheon Company 发明人 Mcspadden James
分类号 H05B6/76;H05B6/64 主分类号 H05B6/76
代理机构 代理人
主权项 1. A microwave module lid, comprising: an inner side operable to define, at least in part, a cavity configured to have a radio frequency (RF) emitting component disposed therein; at least two dielectric layers proximate one another, each layer having a thickness, a dielectric constant, and a dielectric loss characteristic; and a metal backing layer proximate one of the dielectric layers to contain RF energy within the microwave module lid, wherein the thicknesses, the dielectric constants, the dielectric loss characteristics, or combinations thereof of the at least two dielectric layers are configured to minimize RF resonance in the cavity.
地址 Waltham MA US