STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS

摘要

A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

主权项

1. A method of fabricating a microelectronic assembly, comprising:
(a) assembling a first microelectronic element with a second microelectronic element such that a first surface of the first microelectronic element faces a first surface of the second microelectronic element, each of the microelectronic elements embodying active semiconductor devices, such that an electrically conductive pad exposed at the first surface of one of the microelectronic elements is juxtaposed with a first conductive element exposed at the first surface of another of the microelectronic elements; and (b) then forming a second electrically conductive element extending within a first opening extending from a rear surface of the first microelectronic element towards the first surface thereof, within a second opening extending from the first opening towards the first surface of the first microelectronic element, and within a third opening extending through at least one of the pad or the first electrically conductive element, wherein interior surfaces of the first and second openings extend in first and second directions relative to the first surface respectively defining a substantial angle, the second conductive element contacting the pad and the first electrically conductive element.