PLATING APPARATUS AND CONTAINER BATH

摘要

Provided are: a plating apparatus which has a simpler structure than conventional plating apparatuses and is capable of improving the uniformity of plating thickness; and a container bath. This plating apparatus (M) is provided with: a plating bath (10) that contains a plating liquid (F); a positive electrode member (20) that is arranged within the plating bath (10); an object to be plated (W), which is arranged within the plating bath (10) so as to face the positive electrode member (20); a negative electrode jig (30) that is in contact with the object to be plated (W); and a space (40) that is formed between the positive electrode member (20) and the object to be plated (W) and serves as a channel into which the plating liquid (F) flows from the plating bath (10). The plating liquid (F) flows into the space (40) from above, and is sucked out from the bottom part of the space (40) by means of a pump (50).