发明名称 |
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOMETER DIE AND METHODS FOR THE PRODUCTION THEREOF |
摘要 |
Methods for fabricating multi-sensor microelectronic packages and multi-sensor microelectronic packages are provided. In one embodiment, the method includes positioning a magnetometer wafer comprised of an array of non-singulated magnetometer die over an accelerometer wafer comprised of an array of non-singulated accelerometer die. The magnetometer wafer is bonded to the accelerometer wafer to produce a bonded wafer stack. The bonded wafer stack is then singulated to yield a plurality of multi-sensor microelectronic packages each including a singulated magnetometer die bonded to a singulated accelerometer die. |
申请公布号 |
US2015329352(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201514806481 |
申请日期 |
2015.07.22 |
申请人 |
FREESCALE SEMICONDUCTOR INC. |
发明人 |
BOWLES PHILIP H.;HOOPER STEPHEN R. |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A multi-sensor microelectronic package, comprising:
a singulated accelerometer die having a first Microelectromechanical Systems (MEMS) transducer structure; a singulated magnetometer die positioned over the first MEMS transducer structure; a ring of bonding material bonding the singulated magnetometer die to the singulated accelerometer die; and a first hermetically-sealed cavity formed between the singulated magnetometer and the singulated accelerometer die, circumferentially bounded by the ring of bonding material, and enclosing the first MEMS transducer structure. |
地址 |
Austin TX US |