| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning solvent, cleaning equipment, and a method for cleaning a mounting substrate which enable the execution of high-quality cleaning even with a novel solder, such as a lead-free solder.SOLUTION: A cleaning solvent 2 is used to clean a mounting substrate 10. The cleaning solvent 2 is a chemical solution comprising: a hydrocarbon based solvent containing ketone or aromatics; organic amines included in the solvent; and an anhydrous unsaturated carboxylic acid compound or an anhydrous carboxylic acid added to the solvent. The organic amines include at least one kind of diethanolamine and trimethylamine, which are a secondary or tertiary amine. That is, the cleaning solvent 2 includes at least one kind of dehydrated unsaturated carboxylic acid compounds (e.g. anhydrous abietic acid and anhydrous neoabietic acid), and dehydrated dicarboxylic acids (e.g. formic acid, anhydrous acetic acid, and anhydrous valerianic acid). The amine components are equal to or less than the carboxylic acids in chemical equivalent. |
