| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical Ni plating liquid capable of forming a homogeneous porous Ni plating layer.SOLUTION: Provided is an electrical Ni plating liquid comprising Ni ions by 0.01 to 1 mol/L, ammonia by 0.2 to 30 mol/L and at least one kind of ion selected from ammonium ions and alkali metal ions by 0.2 to 10 mol/L, in which the molar ratio of the ammonia to the Ni ions, (NH/Ni ions) is 1 or more, and also, having a pH of 6 or more. The electrical Ni plating liquid includes an aqueous polymer in the case hole diameter is required to be made large, and includes a surfactant in the case hole diameter is required to be made small. The electrical Ni plating liquid includes Ni ions, ammonium ions and at least one kind of ions selected from chloride ions, sulfate ions, sulfamic acid ions and acetic ions as the counter anions of the alkali metal ions. |
