| 摘要 |
PROBLEM TO BE SOLVED: To provide an inter-board connection structure that can keep high adhesion and is detachable in an inter-board connection structure for transmitting, among plural circuit boards, high-frequency signals transmitted in a waveguide provided in each circuit board for handling a high-frequency band.SOLUTION: In an inter-board connection structure for connecting at least parts of an opening portion 4 of an antenna mount board 1A and an opening portion 7 of an IC mount board 1B, an insulating film 8 whose thickness is 60% or less of the width dimension of the waveguide 3 of the antenna mount board 1A and the waveguide 6 of the IC mount board 1B is provided to a surface at the opening portion 7 side of the IC mount board 1B. |
