发明名称 PHYSICAL QUANTITY SENSOR AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To simplify an inspection process.SOLUTION: A first connection member 41 for only mechanically connecting a sensor chip 10 to a circuit chip 20 is disposed between the sensor chip 10 and the circuit chip 20. The sensor chip 10 is electrically connected to the circuit chip 20 via a bonding wire 51. Thus, by visually inspecting the connection part between the bonding wire 51 and the sensor chip 10 and circuit chip 20, it can be inspected whether the sensor chip 10 is electrically connected to the circuit chip 20, and the inspection process can be simplified.
申请公布号 JP2015206636(A) 申请公布日期 2015.11.19
申请号 JP20140086242 申请日期 2014.04.18
申请人 DENSO CORP 发明人 SUGIMOTO YOSHIMASA;YOSHIDA NAOKI
分类号 G01C19/5783 主分类号 G01C19/5783
代理机构 代理人
主权项
地址