发明名称 配線基板
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which allows for effective suppression of problems, i.e., floating or peeling of wiring from an insulating layer, in a wiring board where one or more conductor layers and insulating layers are laminated.SOLUTION: In a wiring board where one or more conductor layers and insulating layers are laminated, the conductor layer includes first wiring formed on the insulating layer, at the ends of an abutment surface against the insulating layer and a surface facing the insulating layer, and having a spaced surface not abutting against the insulating layer, and second wiring filling between the insulating layer and spaced surface, and electrically connecting the first wiring.
申请公布号 JP2015207710(A) 申请公布日期 2015.11.19
申请号 JP20140088420 申请日期 2014.04.22
申请人 发明人
分类号 H05K3/24;H05K3/46 主分类号 H05K3/24
代理机构 代理人
主权项
地址