| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that reduces the influence of by-products and suppresses deterioration in film quality and yield, and to provide a method of manufacturing a semiconductor device.SOLUTION: A substrate treatment apparatus includes: a treatment chamber 201 in which a substrate 200 is treated; a substrate mounting table 212 that is provided in the treatment chamber 201; a first supply passage 252 that includes first gas supply holes 262 for supplying a first gas and is provided at a position facing a substrate mounting surface 211 of the substrate mounting table 212; a second supply passage 251 that includes second gas supply holes 261 for supplying a second gas reacting with the first gas; and an exhaust passage 250 that includes exhaust holes 260. The substrate treatment apparatus further includes a shower head 240 in which the first supply passage 252, the second supply passage 251, and a third supply passage are independently installed. |
