ARTICLES INCLUDING BONDED METAL STRUCTURES AND METHODS OF PREPARING THE SAME

摘要

Articles including bonded metal structures and methods of preparing the same are provided herein. In an embodiment, a method of preparing an article that includes bonded metal structures includes providing a first substrate. A first metal structure and a second metal structure are formed on the first substrate. The first metal structure and the second metal structure each include an exposed contact surface. A bond mask is formed over the contact surface of the first metal structure. A second substrate is bonded to the first substrate through the exposed contact surface of the second metal structure. The bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate. A wire is bonded to the exposed contact surface of the first metal structure.

主权项

1. A method of preparing an article including bonded metal structures, the method comprising:
providing a first substrate; forming a first metal structure and a second metal structure on the first substrate, wherein the first metal structure and the second metal structure each comprise an exposed contact surface; forming a bond mask over the contact surface of the first metal structure; bonding a second substrate to the first substrate through the exposed contact surface of the second metal structure, wherein the bond mask remains disposed over the exposed contact surface of the second metal structure during bonding of the second substrate to the first substrate; and bonding a wire to the exposed contact surface of the first metal structure.