发明名称 |
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT |
摘要 |
Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for aligning an electronic feature to a through-substrate via includes forming a self-aligned alignment feature having a wall around at least a portion of the TSV and aligning a photolithography tool to the self-aligned alignment feature. In some embodiments, the self-aligned alignment feature is defined by the topography of a seed material at a backside of the device. |
申请公布号 |
US2015333014(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201414281362 |
申请日期 |
2014.05.19 |
申请人 |
Micron Technology, Inc. |
发明人 |
Wirz Brandon P.;Ypma Keith;Gambee Christopher J.;Gandhi Jaspreet S.;Dowdle Kevin M.;Vasilyeva Irina;Chao Yang;Hacker Jon |
分类号 |
H01L23/544;H01L21/768;H01L23/48 |
主分类号 |
H01L23/544 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Boise ID US |