DEFECT OBSERVATION METHOD AND DEFECT OBSERVATION DEVICE

摘要

The purpose of the present invention is to easily extract, from samples to be observed, defect candidates that can be labeled as a defect or “nuisance” (a part for which a manufacturing tolerance or the like is erroneously detected) and to allow parameters pertaining to observation processing to be easily adjusted. This defect observation method comprises: an imaging step to image, on the basis of defect information from an inspection device, an object to be inspected and obtain a defect image and a reference image corresponding to the defect image; a parameter determining step to determine a first parameter to be used in the defect extraction by using a first feature set distribution acquired from the reference image and the defect image captured in the imaging step and a second feature net distribution acquired from the reference image; and an observing step to observe using the first parameter determined in the parameter determining step. The present invention can be applied to a method of observing defects generated during the manufacturing of semiconductor wafers.

主权项

1. A defect observation method comprising:
an imaging process for imaging an inspection object on the basis of defect information from an inspection device and obtaining a defect image and a reference image corresponding to the defect image; a parameter determination process for determining a first parameter to be used in defect extraction by using first feature quantity distribution obtained from the defect image picked up in the imaging process and the reference image and second feature quantity distribution obtained from the reference image; and an observation process for conducting observation by using the first parameter determined in the parameter determination process.