发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of favorably actuating a semiconductor element by sufficiently supplying sufficient power to the semiconductor element.SOLUTION: In a wiring board 10 comprising ground through holes 5G which are arranged alternately and adjacent to power supply through holes 5P so as to pierce a core substrate 1, each of the ground through holes 5G and the power supply through holes 5P has a substantially square-shaped horizontal sectional shape having corners and sides that link the corners, and the ground through holes 5G and the power supply through holes 5P are arranged in a manner such that the sides of the neighboring through holes are opposed to each other. An opposing area between the ground through hole 5G and the power supply through hole 5P adjacent to each other is increased and this minimizes loop inductance between both to enable sufficient power supply to a semiconductor element S.
申请公布号 JP2015207677(A) 申请公布日期 2015.11.19
申请号 JP20140087874 申请日期 2014.04.22
申请人 KYOCERA CIRCUIT SOLUTIONS INC 发明人 SHIROSHITA MAKOTO;WADA HISAYOSHI
分类号 H05K1/02;H01L23/12;H05K3/46 主分类号 H05K1/02
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