METHOD FOR PURIFYING AND MICRO-ETCHING SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for improving the whole performance and appearance of a semiconductor wafer by removing pollutant from the semiconductor wafer after cutting a semiconductor ingot, and minimizing wafer pollution by conductive metal degrading the efficiency of a solar battery.SOLUTION: Inorganic and organic pollutants are removed from a semiconductor wafer with alkaline aqueous solution including one or more types of quaternary ammonium hydroxide, one or more types of alkali hydroxide and one or more types of mid-range alkoxylate, and the semiconductor wafer is micro-etched.