METAL BASE BOARD, MANUFACTURING METHOD THEREOF, METAL BASE CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a metal base board which has a metal layer of a particular thickness, and is superior in circuit workability, and which can be adapted for high current use over a long period of time.SOLUTION: A metal base board 100 of the present invention comprises: a metal substrate 101; an insulative resin layer 102 provided on the metal substrate 101; and a metal layer 103 provided on the insulative resin layer 102. In the metal base board 100, the insulative resin layer 102 is formed of an epoxy resin composition; the epoxy resin composition includes a phenoxy resin; and the metal layer 103 is composed of a piece of copper foil having a thickness in a range of 170-230 μm.