发明名称 |
CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS OF FABRICATION |
摘要 |
A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120. iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided. |
申请公布号 |
WO2015175559(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
WO2015US30416 |
申请日期 |
2015.05.12 |
申请人 |
INVENSAS CORPORATION |
发明人 |
SHEN, HONG;SUN, ZHUOWEN;WOYCHIK, CHARLES, G.;SITARAM, ARKALGUD, R. |
分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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