SHEET-LIKE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

Provided are a sheet-like resin composition with which it possible to easily carry out alignment for mounting of a semiconductor element without changing an existing process, and a method for producing a semiconductor device using said sheet-like resin composition. The present invention is a sheet-like resin composition for filling a space between an adherent and a semiconductor element which is electrically connected to the adherent, said composition having a parallel transmittance of 10% or more. The haze of the sheet-like resin composition is preferably 80% or less. The transmittance of the sheet-like resin composition at a wavelength of 580 nm is preferably 15% or more.