BI-DIRECTIONAL CAMERA MODULE FOR FLIP CHIP BONDER USED THE SAME

摘要

The present invention discloses a flip chip bonding apparatus having a bidirectional camera module and comprising the same. The module includes: a circuit board on which an upper sensor and a lower sensor are mounted; an upper lens and a lower lens having the upper sensor and the lower sensor disposed on and under the same, respectively; and a housing which separates the upper lens and the lower lens from the upper sensor and the lower sensor, and fixes the same, and which surrounds the circuit board. The housing may have a plurality of inlets and outlets which blows air, and have an air passage connected from the inlets to outlets via the lower lens and the lower sensor.