CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD

摘要

Provided are a circuit board and a multilayer circuit board capable of punching a hole for connecting an electronic device using photolithography. The circuit board comprises: an insulating layer (2) where an insulating layer hole (23) penetrating from a front plane (21) to an opposite plane (22) is formed; a conductive layer (3) which is formed on one plane of the insulating layer (2) at least; a connection conductor (4) which is inserted into the insulating layer hole (23), and has a through-hole (41) in parallel with the insulating layer hole (23), and at the same time is installed to be connected to the conductive layer (3) electrically; and a coating layer (5) formed on the conductive layer (3). The conductive layer (3) has a first conductive layer hole (33) which penetrates the conductive layer (3) and is linked to the insulating layer hole (23), and a second conductive layer hole (34) which penetrates the conductive layer (3) and at the same time is not linked to the insulating layer hole (23). The coating layer (5) contains a polyimide photo resist, and fills the second conductive layer hole (34), and covers an inner surface of the through-hole (41) of the connection conductor (4) at least.