发明名称 Heat-dissipation apparatus
摘要 <p>A heat-dissipation apparatus comprises a first heat conductive plate, a second heat conductive plate which bonds the first conductive plate, and a fin assembly. The first heat conductive plate has a plurality of first protrusions and a plurality of passageways interposed between the first protrusions. The second heat conductive plate has a plurality of second protrusions, and these second protrusions wedge in the passageways on the first conductive plate to interpose between the first protrusions. The fin assembly has a plurality of individual heat-dissipation fins, and part of each heat-dissipation fin is sandwiched tightly between the first protrusion and the second protrusion. The heat-dissipation apparatus is simply with punching to complete assembling and further to be provided with excellent efficiency</p>
申请公布号 EP2216807(A3) 申请公布日期 2015.11.18
申请号 EP20090004869 申请日期 2009.04.02
申请人 GIGA-BYTE TECHNOLOGY CO., LTD. 发明人 HUANG, SHUN CHIH
分类号 H01L21/48;H01L23/367 主分类号 H01L21/48
代理机构 代理人
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