| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device manufacturing method which can prevent variation in a luminescent color among products and unevenness (color temperature difference) of a luminescent color in a light-emitting surface by resolving a density distribution deviation of phosphor particles in a resin material in compression molding of a phosphor-containing resin. <P>SOLUTION: A semiconductor light-emitting device manufacturing method comprises: mounting a plurality of luminous elements 20 on an element mounting surface of a substrate 10; supplying a phosphor-containing resin 30 containing phosphor particles to a mold having on a reference surface, a plurality of cavities arranged correspondingly to an arrangement of the plurality of luminous elements on the substrate; and compression molding the phosphor-containing resin by pressing the mold to the substrate in such a manner that each luminous element is housed in each cavity and the element mounting surface and the reference surface are attached firmly to each other with the phosphor-containing resin being sandwiched therebetween. The substrate has protrusions 12 extending on the element mounting surface, outside a region corresponding to a supply region of the phosphor-containing resin and along an arrangement direction of the plurality of luminous elements. <P>COPYRIGHT: (C)2013,JPO&INPIT |
