发明名称 半導体装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can mechanically couple an output side terminal of a semiconductor module and an input side terminal of an external device to support them and electrically connect the output side terminal of the semiconductor module and the input side terminal of the external device while omitting an additional terminal block. <P>SOLUTION: A semiconductor device comprises connection conductors 83(U)-85(W) electrically connecting output terminals 232, 242, 252, 332, 342, 352 of semiconductor elements 23(U)-25(W), 33(U)-35(W) and connection terminals of external devices. Each of the connection conductors has a block structure. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5816504(B2) 申请公布日期 2015.11.18
申请号 JP20110210651 申请日期 2011.09.27
申请人 株式会社ケーヒン 发明人 阿部 秀文;阿部 聖一郎;柴 徹;八木 卓也
分类号 H02M7/48 主分类号 H02M7/48
代理机构 代理人
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