发明名称 レーザ加工装置、及び、レーザ加工方法
摘要 <p><P>PROBLEM TO BE SOLVED: To perform the machining of high quality in a short machining time. <P>SOLUTION: (i) A laser machining apparatus includes: a reference beam source for emitting the reference beam passing through a fume generated when allowing the pulse laser beam emitted from a machining laser beam source to be incident at the machining position of a workpiece held by a stage; and a detector for detecting the reference beam which is emitted from the reference beam source and passes through the fume; wherein a control device controls the total energy per unit area to be charged at the machining position of the workpiece based on the fume absorption amount of the reference beam detected by the detector. Alternatively, (ii) the laser machining apparatus includes a detector for detecting the beam emitted from fume generated when allowing the pulse laser beam emitted from the machining laser beam source to be incident at the machining position of the workpiece held by the stage, wherein a control device controls the total energy per unit area to be changed at the machining position of the workpiece based on the beam intensity at the predetermined wavelength of the beam emitted from the fume and detected by the detector. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5818646(B2) 申请公布日期 2015.11.18
申请号 JP20110249704 申请日期 2011.11.15
申请人 发明人
分类号 B23K26/00;B23K26/40;H05K3/00 主分类号 B23K26/00
代理机构 代理人
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