HEATING DEVICE FOR HOT STAMPING

摘要

A heating device for hot stamping (1) is configured to heat a plated metallic material (9) while conveying the plated metallic material. The heating device for hot stamping comprises: a first heating tank (3A) provided in a conveyance path for the plated metallic material; and a second heating tank (3B) provided downstream of the first heating tank in the conveyance path (2). A heating amount provided by the second heating tank is configured such that a temperature of the plated metallic material becomes equal to or higher than Ac3 point and less than a boiling point of a plating of the plated metallic material, and a heating amount provided by the first heating tank is configured to be larger than the heating amount provide by the second heating tank.