| 摘要 |
It is intended to enable a substrate made of a thick plate material with a high laser beam absorption rate to be easily processed by means of boring or so forth in a short time. The present device includes a work table (2) on which a substrate is disposed, a laser beam output section (15), a rotation unit, a beam focusing unit and a scan unit. The laser beam output section (15) is configured to output a laser beam, having a wavelength with an absorption rate of 50% or greater, onto the substrate. The rotation unit is configured to rotate the laser beam emitted from the laser beam output section (15) with a predetermined rotation radius. The beam focusing unit is configured to focus the laser beam from the rotating unit onto a depth position included within the substrate, the depth position is located closer to one substrate surface disposed on a laser beam irradiation side than to the other substrate surface. The scan unit is configured to scan the focused and rotated laser beam along a processing line, and is also configured to repeatedly execute the scanning so as to process the substrate. |
