| 发明名称 |
BONDING COMPOSITION AND BOARD |
| 摘要 |
<p>The purpose of the present invention is to provide a bonding composition having high adhesion, from which formaldehyde is hardly released. The present invention relates to a bonding composition cured through heating and pressing. The bonding composition contains a polyvalent carboxylic acid.</p> |
| 申请公布号 |
EP2692810(B1) |
申请公布日期 |
2015.11.18 |
| 申请号 |
EP20120763311 |
申请日期 |
2012.03.23 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
SUGAWARA, RYO;UMEMURA, KENJI |
| 分类号 |
C09J133/02;B27D1/04;B27N3/00;C09J11/06;C09J105/00;C09J135/00 |
主分类号 |
C09J133/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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