发明名称 |
PRODUCTION METHOD FOR SEALING LAYER-COATED SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A method for producing an encapsulating layer-covered semiconductor element includes a disposing step of disposing a semiconductor element on a support, an encapsulating step of embedding and encapsulating the semiconductor element by an encapsulating layer in an encapsulating sheet including a peeling layer and the encapsulating layer laminated below the peeling layer and made from a thermosetting resin before complete curing, and a heating step of heating and curing the encapsulating layer after the encapsulating step. The heating step includes a first heating step in which the encapsulating sheet is heated under a normal pressure at a first temperature, a peeling step in which the peeling layer is peeled from the encapsulating layer after the first heating step, and a second heating step in which the encapsulating layer is heated at a second temperature that is higher than the first temperature after the peeling step.</p> |
申请公布号 |
EP2876673(A4) |
申请公布日期 |
2015.11.18 |
申请号 |
EP20130819869 |
申请日期 |
2013.07.17 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MITANI, MUNEHISA;EBE, YUKI;OOYABU, YASUNARI;NORO, HIROSHI;KONO, HIROKI |
分类号 |
H01L33/56;H01L21/56;H01L23/29;H01L33/54 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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