发明名称 Semiconductive device and associated method of manufacture
摘要 <p>The disclosure relates to a semiconductive device comprising a body having: a first surface and an opposing second surface; a first semiconductive layer adjacent to the first surface; an active region comprising: a plurality of active trenches in the first surface, the plurality of active trenches extending from the first surface into the first semiconductive layer and having an active trench width, and a plurality of active cells, each active cell provided in the first semiconductive layer adjacent to an active trench, the active cells having an active cell width; and a termination region at a periphery of the first surface comprising: at least one termination trench, the at least one termination trench extending from the first surface into the first semiconductive layer, wherein the termination region has a width that is greater than the active trench width; and a number of termination trench separators having a width that is less than the active cell width, wherein the active trenches and the at least one termination trench each comprise a first insulator layer adjacent to the first semiconductive layer of the body, and wherein conductive material is disposed on the first insulating layer within each of the active trenches.</p>
申请公布号 EP2945192(A1) 申请公布日期 2015.11.18
申请号 EP20140176589 申请日期 2014.07.10
申请人 NXP B.V. 发明人 BOETTCHER, TIM;BEHTASH, REZA;IGEL-HOLTZENDORFF, THOMAS;ZHU, LINPEI
分类号 H01L29/872;H01L21/329 主分类号 H01L29/872
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