发明名称 全熱交換素子用仕切部材およびその全熱交換素子用仕切部材を用いた全熱交換素子および熱交換形換気装置
摘要 <p>Partitioning member (1) for total heat exchange element includes porous base material (2), and porous base material (2) is filled with hydrophilic polymer compound (3) at a surface and an inside thereof. Hydrophilic polymer compound (3) is formed by polymerizing a low-molecular-weight organic compound having a quaternary ammonium group and an amide group, and represented by chemical formula (1): wherein A is a linear or branched alkylene group having 1 to 10 carbon atoms; R1, R2 and R3 are linear or branched alkyl groups each independently having 1 to 8 carbon atoms; and Y has a polymerizable functional group, and is polymerized to form a main chain of the hydrophilic polymer compound.</p>
申请公布号 JP5816821(B2) 申请公布日期 2015.11.18
申请号 JP20120199157 申请日期 2012.09.11
申请人 パナソニックIPマネジメント株式会社 发明人 大友 みゆき;浜田 洋祐
分类号 F28F3/00;C08F20/60;C08J9/40;D06M15/285;F24F7/08;F28F3/08 主分类号 F28F3/00
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