发明名称 Semiconductor EEPROM device and method of manufacturing the same
摘要 <p>A semiconductor EEPROM device comprising a first insulating film (14A) provided on a semiconductor substrate (13) in a cell transistor region, a first conductive film (15) provided on the first insulating film, an inter-electrode insulating film (16) provided on the first conductive film, a second conductive film (3a,3b) provided on the inter-electrode insulating film and having a first metallic silicide (3b) film on a top surface thereof, first source/drain regions (23) formed on a surface of the semiconductor substrate, a second insulating film (14B) provided on the semiconductor substrate in at least one of a selection gate transistor region and a peripheral transistor region, a third conductive film (3a,3b,22) provided on the second insulating film and having a second metallic silicide film (22) having a thickness smaller than a thickness of the first metallic silicide film (3b) on a top surface thereof, and a second source/drain (23a,23b) regions formed on the surface of the semiconductor substrate.</p>
申请公布号 EP1901346(B1) 申请公布日期 2015.11.18
申请号 EP20070017977 申请日期 2007.09.13
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ENDO, MASATO;ARAI, FUMITAKA
分类号 H01L27/115;H01L21/28;H01L21/8247;H01L27/105 主分类号 H01L27/115
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