| 摘要 |
A method of forming a resist pattern including: step (1) in which a resist composition including a base component and a photobase generator component is applied to a substrate to form a resist film; step (2) in which the resist film is subjected to immersion exposure; step (3) in which baking is conducted after step (2), such that, at an exposed portion of the resist film, the base generated from the photobase generator component and an acid provided to the resist film in advance are neutralized, and at an unexposed portion of the resist film, the solubility of the base component in an alkali developing solution is increased by the action of the acid; and step (4) in which the resist film is subjected to an alkali development, thereby forming a negative-tone resist pattern, wherein a receding angle of water on the resist film is 65° or more. |
