| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce deformation of a lead pin caused by contact with another lead pin when dividing the multi-piece wiring board. <P>SOLUTION: A multi-piece wiring board 10 comprises: a mother board 1 including a plurality of wiring board regions 1a and division trenches 2 provided at boundaries of the plurality of wiring board regions 1a; conductor layers 3 provided on a surface of the mother board 1 in the plurality of wiring board regions 1a, respectively; and lead pins 4 bonded to the conductive layers 3. An extended line 2b from an inner face 2a of the division trench does not intersect the lead pins 4. With this configuration, because warp of the multi-piece wiring board 10 caused by contact of opposed parts of the inner face 2a of the division trench 2 is inhibited, contact of lead pins 4 provided in the neighboring wiring board regions 1a is inhibited, thereby reducing deformation of the lead pins 4 of wiring boards 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
