FLUX FOR SOLDER PASTE, SOLDER PASTE AND MANUFACTURING METHOD OF SOLDER BUMP

摘要

Provided is flux for solder paste comprising: a triethylene glycol-based compound including at least one of triethylene glycol bis(2-ethylhexanoate), and a derivative of triethylene glycol bis(2-ethylhexanoate); a binder; an activator; a thixo agent; and a solvent. As such, the present invention prevents a dry film resist from dissolving or swelling in a solder paste printing process.