| 摘要 |
Provided is a thermal treatment device capable of quickly and equally heating a substrate which is bent when temperature rises. In regard to a thermal treatment device (1), a substrate (W) which is bent when temperature rises, and then returned to a flat state is disposed on a heating plate (2) which is controlled according to a heating temperature. A support member (3) supports the substrate (W) from a lower surface, and is elevated between a delivery position of an upper part and a position of a lower part of the heating plate (2) by elevating members (31, 32). A control part (4) raises the temperature of the substrate up to the temperature of being bent by heat from the heating plate (2) in an upper part of the heating plate (2) while the substrate (W) is being dropped from the delivery position. The substrate (W) is placed on the heating plate (2) after the elapse of return time when the substrate (W) is returned to the flat state. |
