CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip electronic component and a manufacturing method thereof and, more particularly, to a chip electronic component and a manufacturing method thereof, capable of preventing the loss of inductance due to a via pad area by reducing the size of a via pad, reducing the size of an outermost via electrode, and improving the connectivity between inner coils formed on the upper and lower sides of an insulation substrate.