METHOD OF PACKAGING SEMICONDUCTOR DEVICES AND APPARATUS FOR PERFORMING THE SAME

摘要

In a method and apparatus to package semiconductor devices mounted on a flexible substrate on which packaging regions are defined in an extension direction with a tape shape which is long extended; the flexible substrate is transferred through a packaging module. An empty region on which the semiconductor device is not mounted is detected among the packaging regions by a camera. Heat radiation paint is sprayed on at least one semiconductor device located in a processing region of a packaging module by a screen printing process; thus a heat radiation layer to package the semiconductor device is formed. Here, the operation of the packaging module is controlled by a control unit to omit the packaging process for the empty region.