Detecting defects on a wafer using defect-specific information

摘要

Methods and systems for detecting defects on a wafer using defect-specific information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest formed on the wafer and a known DOI occurring proximate to or in the pattern of interest. The information includes an image of the target on the wafer. The method also includes searching for target candidates on the wafer or another wafer. The target candidates include the pattern of interest. The target and target candidate locations are provided to defect detection. In addition, the method includes detecting the known DOI in the target candidates by identifying potential DOI locations in images of the target candidates and applying one or more detection parameters to images of the potential DOI locations.

主权项

1. A computer-implemented method for detecting defects on a wafer, comprising:
acquiring information for a target on a wafer, wherein the target comprises a pattern of interest formed on the wafer and a known defect of interest having a location that is known and unique relative to a location of the pattern of interest, and wherein the information comprises an image of the target on the wafer acquired by imaging the target on the wafer, the location of the pattern of interest on the wafer, the location of the known defect of interest relative to the pattern of interest, and one or more characteristics computed from the pattern of interest and the known defect of interest; searching for target candidates on the wafer or on another wafer, wherein the target candidates comprise the pattern of interest; and detecting the known defect of interest in the target candidates by identifying potential defect of interest locations in images of the target candidates and applying one or more detection parameters to images of the potential defect of interest locations, wherein said detecting is performed using a computer system.