Linking circuitry for IC TAP, core TAP, off-chip TAP interface

摘要

An IC includes an IEEE 1149.1 standard test access port (TAP) interface and an additional Off-Chip TAP interface. The Off-Chip TAP interface connects to the TAP of another IC. The Off Chip TAP interface can be selected by a TAP Linking Module on the IC.

主权项

1. An integrated circuit comprising:
A. a substrate; B. a TDI input pad, a TCK input pad, a TMS input pad, and a TDO output pad, all formed on the substrate; C. an IC TAP domain formed on the substrate, the IC TAP domain having an IC TDI input lead, an IC TCK input lead, an IC TMS input lead, and an IC TDO output lead; D. a core TAP domain formed on the substrate, the core TAP domain having a core TDI input lead, a core TCK input lead, a core TMS input lead, and a core TDO output lead; E. an off-chip TAP interface formed on the substrate, the off-chip TAP interface having an interface TDI input lead, an off-chip TDO output lead coupled to the interface TDI input lead, an interface TCK input lead, an off-chip TCK output lead coupled to the interface TCK input lead, an interface TMS input lead, an off-chip TMS output lead coupled to the interface TMS input lead, an interface TDO output lead, and an off-chip TDI input lead coupled to the interface TDO output lead; F. input linking circuitry formed on the substrate, the input linking circuitry coupling one of the TDI input pad, the IC TDO output lead, the core TDO output lead, and the interface TDO output lead to one of the IC TDI input lead, the core TDI input lead, and the interface TDI input lead, and the input linking circuitry coupling the TMS input pad to the TMS input lead of the selected IC TAP domain, the core TAP domain, and the TAP interface in response to control signals on control input leads; G. output linking circuitry formed on the substrate, the output linking circuitry selectively coupling the one of the IC TDO output lead, the core TDO output lead, and the interface TDO output lead to the TDO output pad in response to control signals on control input leads; and H. linking control circuitry formed on the substrate and connected in series between the TDI input pad and the TDO output pad, the linking control circuitry having control output leads connected to the control input leads of the input linking circuitry and the output linking circuitry.