发明名称 Polyimides as dielectric
摘要 The present invention provides a process for the preparation of a transistor on a substrate, which transistor comprises a layer, which layer comprises polyimide B, which process comprises the steps of i) forming a layer comprising photocurable polyimide A by applying photocurable polyimide A on a layer of the transistor or on the substrateii) irradiating the layer comprising photocurable polyimide A with light of a wavelength of >=360 nm in order to form the layer comprising polyimide B, and a transistor obtainable by that process.
申请公布号 US9187600(B2) 申请公布日期 2015.11.17
申请号 US201113286639 申请日期 2011.11.01
申请人 BASF SE 发明人 Kirner Hans Jürg;Kastler Marcel;Martin Emmanuel
分类号 H01G4/18;C08G73/10;H01L51/00;C09D179/08;H01L51/50 主分类号 H01G4/18
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A process for the preparation of an organic field-effect transistor (OFET) on a substrate, which organic field-effect transistor comprises a layer, which layer comprises polyimide B, and an additional layer comprising a semiconducting material, wherein the semiconducting material comprises units having a diketopyrrolopyrrole group (DPP polymer), wherein the process comprises i) forming a layer comprising photocurable polyimide A by applying photocurable polyimide A as a solution in an organic solvent A on the layer comprising the semiconducting material, wherein the organic solvent A is a mixture of butyl acetate and cyclopentanone in a weight ratio of butyl acetate/cyclopentanone is at least from 99/1 to 20/80,ii) irradiating the layer comprising photocurable polyimide A with light of a wavelength of >=360 nm to form the layer comprising polyimide B.
地址 Ludwigshafen DE