| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a soldering apparatus and a soldering method which effectively remove an air layer near a connection part between a printed circuit board and an electronic component and make solder oxide and the like less likely to adhere to a jetting port.SOLUTION: A soldering apparatus 1 places melting solder 2 jetted from a jetting port 3 in contact with a printed circuit board 15 to thereby soldering, and has a solder tank 4 and a spiral flow generation member 20. The solder tank 4 has the jetting port 3 and is used for accumulating the melting solder 2. The spiral flow generation member 20 is formed so as to generate spiral flow in the melting solder 2 jetted from the jetting port 3 of the solder tank 4.</p> |
