发明名称 Methods for making a semiconductor device with shaped source and drain recesses and related devices
摘要 A method for making a semiconductor device includes forming at least one gate stack on a layer comprising a first semiconductor material and etching source and drain recesses adjacent the at least one gate stack. The method further includes shaping the source and drain recesses to have a vertical side extending upwardly from a bottom to an inclined extension adjacent the at least one gate stack.
申请公布号 US9190517(B2) 申请公布日期 2015.11.17
申请号 US201414518590 申请日期 2014.10.20
申请人 STMICROELECTRONICS, INC.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Loubet Nicolas;Latulipe Douglas;Reznicek Alexander
分类号 H01L29/78;H01L27/092;H01L29/417;H01L29/165;H01L29/66 主分类号 H01L29/78
代理机构 Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. 代理人 Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
主权项 1. A semiconductor device comprising: a layer comprising a first semiconductor material; at least one gate stack on said layer; source and drain regions comprising a second semiconductor material adjacent said at least one gate stack; each source and drain region having a bottom, a vertical side extending upwardly from the bottom, and an inclined extension extending from the vertical side adjacent the at least one gate stack, said bottom including at least one upwardly angled section that joins the vertical side; and a liner between each source and drain region and adjacent portions of said layer, said liner comprising the second semiconductor material having a dopant therein.
地址 Coppell TX US