Method for packaging an optical module

摘要

A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.

主权项

1. A method for packaging an optical module, the method comprising the steps of:
(a) defining a light-emitting region and a light-admitting region on a substrate; (b) connecting electrically a light-emitting chip and a light-admitting chip to the light-emitting region and the light-admitting region of the substrate, respectively; (c) forming a transparent encapsulant on the light-emitting chip and the light-admitting chip; (d) forming a shielding layer on the encapsulants and the substrate; and (e) removing the shielding layer above the light-emitting chip and the light-admitting chip, wherein the removal of the shielding layer is achieved by polishing the shielding layer until protruding top ends of the encapsulants are exposed, respectively.