High density substrate routing in BBUL package

摘要

Discussed generally herein are devices that include high density interconnects between dice and techniques for making and using those devices. In one or more embodiments a device can include a bumpless buildup layer (BBUL) substrate including a first die at least partially embedded in the BBUL substrate, the first die including a first plurality of high density interconnect pads. A second die can be at least partially embedded in the BBUL substrate, the second die including a second plurality of high density interconnect pads. A high density interconnect element can be embedded in the BBUL substrate, the high density interconnect element including a third plurality of high density interconnect pads electrically coupled to the first and second plurality of high density interconnect pads.

主权项

1. A method of making a BBUL substrate with a high density interconnect element embedded therein comprising:
situating a first die including a first plurality of high density interconnect pads on a substrate carrier; situating a second die including a second plurality of high density interconnect pads on the substrate carrier; forming a first buildup layer around and over the first and second dies; forming a cavity in the buildup layer such that high density interconnect pads on the first and second dice are exposed; and situating the high density interconnect element in the cavity.