| 发明名称 |
Scribe line structure for wafer dicing and method of making the same |
| 摘要 |
A scribe line structure between die regions is disclosed. The scribe line structure includes a dielectric layer disposed on a substrate; and a plurality of metal structures arranged up-and-down in the dielectric layer on the substrate, the plurality of metal structures comprising metal layers and metal vias, wherein the metal vias are disposed on the dicing path and regions outside the dicing path and the metal vias on the dicing path have a lower metal density than the metal vias not on the dicing path. |
| 申请公布号 |
US9190359(B2) |
申请公布日期 |
2015.11.17 |
| 申请号 |
US201314077225 |
申请日期 |
2013.11.12 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Wu Ping-Chang;Lin Tsung-Shu |
| 分类号 |
H01L23/58;H01L23/544;H01L21/78 |
主分类号 |
H01L23/58 |
| 代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
| 主权项 |
1. A scribe line structure between die regions, comprising:
a dielectric layer disposed on a substrate; and a plurality of metal structures arranged up-and-down in the dielectric layer on the substrate, the plurality of metal structures comprising metal layers and metal vias, wherein the metal vias are disposed on the dicing path and regions outside the dicing path and the metal vias on the dicing path have a lower metal density than the metal vias not on the dicing path. |
| 地址 |
Science-Based Industrial Park, Hsin-Chu TW |
