发明名称 Release films via solventless extrusion processes
摘要 Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques.
申请公布号 US9187678(B2) 申请公布日期 2015.11.17
申请号 US201313953474 申请日期 2013.07.29
申请人 3M Innovative Properties Company 发明人 Boardman Larry D.;Emslander Jeffrey O.;Feisel Bryan C.;Hays David S.;Kinning David J.;Peloquin Richard L.;Yarusso David J.
分类号 C09J7/02;C09D123/04;C08G77/38 主分类号 C09J7/02
代理机构 代理人 Nowak Sandra K.
主权项 1. A tape construction comprising a tape backing, a pressure sensitive adhesive disposed on the tape backing, and a release layer contacted with the adhesive, the release layer comprising a polyolefin and about 0.5 wt % to 10 wt % of an alkyl dimethicone, the alkyl dimethicone having a structure comprising wherein the sum of (a+b+c) is between about 100 and 1000, the ratio of a to the sum of (b+c) is about 98:2 to 94:6, R1 is a linear, branched, or cyclic alkyl group having between 20 and 50 carbon atoms, and R2 is a linear, branched, or cyclic alkyl or alkaryl group having between 6 and 10 carbons.
地址 St. Paul MN US