发明名称 |
Release films via solventless extrusion processes |
摘要 |
Described herein are release layers formed via solventless extrusion. The release layers include a polyolefin and an alkyl dimethicone. The release layers exhibit tailorable release properties from pressure-sensitive adhesives. The release layers are simple to make and require no post-treatment in order to impart the observed release properties. The release layers are adaptable to multilayer extrusion, blown film formation, and cast film formation techniques. |
申请公布号 |
US9187678(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
US201313953474 |
申请日期 |
2013.07.29 |
申请人 |
3M Innovative Properties Company |
发明人 |
Boardman Larry D.;Emslander Jeffrey O.;Feisel Bryan C.;Hays David S.;Kinning David J.;Peloquin Richard L.;Yarusso David J. |
分类号 |
C09J7/02;C09D123/04;C08G77/38 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
Nowak Sandra K. |
主权项 |
1. A tape construction comprising a tape backing, a pressure sensitive adhesive disposed on the tape backing, and a release layer contacted with the adhesive, the release layer comprising a polyolefin and about 0.5 wt % to 10 wt % of an alkyl dimethicone, the alkyl dimethicone having a structure comprising wherein the sum of (a+b+c) is between about 100 and 1000, the ratio of a to the sum of (b+c) is about 98:2 to 94:6, R1 is a linear, branched, or cyclic alkyl group having between 20 and 50 carbon atoms, and R2 is a linear, branched, or cyclic alkyl or alkaryl group having between 6 and 10 carbons. |
地址 |
St. Paul MN US |