Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

摘要

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

主权项

1. A halogen-free resin composition, comprising:
(A) 100 parts by weight of epoxy resin; (B) 70 to 80 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 30 to 46 parts by weight of bisphenol S, wherein the epoxy resin is dicyclopentadiene epoxy resin, and wherein a styrene to maleic anhydride ratio of the styrene-maleic anhydride copolymer is 4/1.