Lead frame and substrate semiconductor package

摘要

A semiconductor chip package includes a lead frame having a die paddle, leads surrounding the paddle and a central window through the paddle. A substrate has a base side and a superior side. A peripheral portion of the base side is secured to the paddle and a central portion of the base side is exposed through the central window. A semiconductor chip is secured to the superior side of the substrate. The semiconductor chip is electrically connected to the plurality of leads and the substrate. A mold compound covers at least portions of the lead frame, the substrate and the semiconductor chip. The chip package can be electrically connected to other devices or a circuit board by way of the leads and BGA pads of the substrate exposed in the central window.

主权项

1. A semiconductor chip package, comprising:
a lead frame having a paddle, a plurality of leads surrounding the paddle and a central window through the paddle; a packaged device including a first semiconductor chip attached and electrically connected to a substrate and a first mold compound covering at least portions of the first semiconductor chip and the substrate, the packaged device having a base side and a superior side, a peripheral portion of the base side secured to the paddle and a central portion of the base side exposed through the central window; a second semiconductor chip secured to the superior side of the packaged device, wherein the second semiconductor chip is electrically connected to the plurality of leads; and a second mold compound covering the packaged device, the second semiconductor chip and at least portions of the lead frame, wherein the central portion of the packaged device includes a substrate ball grid array pad.